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H16-FP7N4L

The H16-FP7N4L is a high-performance compact fanless embedded system built on the AMD Ryzen 7000 / 8000 Series FP7 platform. It integrates 2 × 10GbE RJ45 ports and 2 × 2.5GbE RJ45 ports, supports DDR5 SO-DIMM memory, four M.2 Key-M 2280 high-speed storage interfaces, OCuLink, M.2 Key-E, M.2 Key-B, SIM card slot, TF card slot, and DP + HD display output. With a compact passive-cooling metal chassis, hybrid high-speed networking, all-flash storage expansion, and silent operation, it is ideal for network nodes, storage workstations, edge computing, virtualization platforms, professional workstations, and AI computing nodes.

Core Specifications

  • Model: H16-FP7N4L

  • Processor Platform: AMD Ryzen 7000 / 8000 Series, Zen 4 architecture

  • Socket: FP7

  • Graphics: AMD Radeon integrated graphics

  • Memory: DDR5 SO-DIMM, up to 64GB, up to 5600 MT/s

  • Network: 2 × 10GbE RJ45, 2 × 2.5GbE RJ45

  • Network Controllers: 2 × Intel I226V, 2 × Marvell AQC113

  • Storage: 4 × M.2 Key-M 2280, including 1 × PCIe x4 and 3 × PCIe x2

  • Expansion: 1 × M.2 Key-E 2230, 1 × M.2 Key-B 3052, 1 × OCuLink

  • Display: 1 × DP, 1 × HD

  • USB: 4 × USB-A 3.2, 2 × USB-C 4, 1 × F_USB2.0

  • Other Interfaces: 1 × SIM card slot, 1 × TF card slot, 1 × audio jack, 1 × J_COM, 1 × J_GPIO, 1 × F_PANEL, 4 × reserved antenna holes

  • Cooling Method: Passive cooling, fanless design, airflow recommended

  • Power Input: DC 19V 6.32A or higher

  • Chassis Size: 200 × 130 × 54 mm

  • Device Weight: Approx. 1.15 KG; package weight approx. 1.85 KG including accessories

  • Operating Temperature: 0°C to 50°C

  • Operating Humidity: 5% to 90% relative humidity, non-condensing

Application Scenarios

  • Network nodes

  • Storage workstations

  • Edge computing devices

  • Virtualization platforms

  • Professional workstations

  • AI computing nodes

  • High-speed data processing and multi-service convergence applications

Downloads

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