The G31F 1090NP 4L is an actively cooled industrial network computer based on the Intel Gemini Lake / Gemini Lake-R low-power platform. It integrates 4 × 2.5GbE RJ45 ports, DDR4 SO-DIMM memory support, SATA, M.2 Key-M SSD, and mSATA storage options, plus mPCIe, SIM card, J_COM, and J_GPIO expansion. With a compact metal chassis and intelligent chassis fan cooling system, it provides a balanced solution for performance, heat dissipation, and reliability in lightweight network gateways, industrial control terminals, commercial embedded applications, and edge computing deployments.
The G31F 1090NP 4L is an actively cooled embedded industrial network computer based on the Intel Gemini Lake / Gemini Lake-R low-power platform. It integrates 4 × 2.5GbE RJ45 ports, DDR4 SO-DIMM memory support, SATA, M.2 Key-M SSD, and mSATA storage options, plus mPCIe, SIM card, J_COM, and J_GPIO expansion. With a compact metal chassis and intelligent chassis fan cooling system, it balances performance, heat dissipation, and reliability within a compact footprint.
Intel Gemini Lake Low-Power Platform: Designed for energy-efficient embedded computing and reliable long-term operation.
4 × 2.5GbE RJ45 Ports: Built with 4 Intel I226V Ethernet controllers for high-speed, stable multi-port networking.
DDR4 SO-DIMM Memory: Supports DDR4 SO-DIMM memory, up to 8GB and up to 2400MHz.
Flexible Storage Architecture: Supports SATA, M.2 Key-M SSD, and mSATA for system storage, data storage, or caching configurations.
Rich Expansion Options: Provides mPCIe, SIM card slot, J_COM, and J_GPIO for communication modules and industrial peripherals.
DP + HD Display Output: Supports DP and HD display interfaces for local setup, monitoring, and visualization applications.
Intelligent Active Cooling: Equipped with a smart chassis fan for stable operating temperatures under continuous workloads.
Compact and Reliable Build: Metal chassis design with a system size of approximately 178 × 126 × 56 mm.
Model: G31F 1090NP 4L
Processor Platform: Intel Gemini Lake / Gemini Lake-R
Socket: FCBGA1090
Memory: DDR4 SO-DIMM, up to 8GB, up to 2400MHz
Network: 4 × 2.5GbE RJ45, Intel I226V controllers
Storage: 1 × SATA 2.0, 1 × M.2 Key-M SSD, 1 × mSATA
Expansion: 1 × mPCIe
Display: 1 × DP, 1 × HD
USB: 2 × USB-A 3.0, 2 × USB-A 2.0
Serial Port: 1 × RJ45 COM RS232, 1 × J_COM supporting RS232 or RS485
Other Interfaces: 1 × SIM card slot, 1 × J_GPIO, 1 × F_Panel, 2 × reserved antenna holes
Cooling Method: Active cooling with 1 × smart chassis fan
Power Input: DC 12V 4A or higher
Chassis Size: 178 × 126 × 56 mm
Device Weight: Approx. 1.25 KG; package weight approx. 1.95 KG including accessories
Operating Temperature: 0°C to 50°C
Operating Humidity: 5% to 90% relative humidity, non-condensing
Cybersecurity appliances
IoT edge gateways
Industrial control terminals
Industrial control automation
Commercial embedded applications
Lightweight edge computing applications
Industrial sites, compact server rooms, and sustained workload environments
Contact: Kelly
Phone: 18659912363
Tel: 13636923655
Email: info@bkipc.com
Add: 3rd Floor, Building 2, Meilan IND, Longhua District, Shenzhen, Guangdong, China, 518109