H31F N300 3L2S

The H31F N300 3L2S is a high-performance compact edge networking platform powered by Intel Processor N-series CPUs. It features a hybrid high-speed network design with 3 × 2.5GbE RJ45 ports and 2 × 10Gb SFP+ fiber ports, combining copper and optical connectivity for flexible modern network deployments. The system supports DDR5 SO-DIMM memory, M.2 Key-B+M 2280 storage, M.2 Key-B 3052, M.2 Key-E 2230, SIM card expansion, and active cooling, making it suitable for network communications, cybersecurity appliances, industrial networks, edge gateways, and high-bandwidth data transmission applications.

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Key Features

Intel Processor N-series Platform: Provides an efficient embedded computing foundation for modern edge networking workloads.
3 × 2.5GbE RJ45 Ports: Built with 3 Intel I226V Ethernet controllers for reliable high-speed copper network connectivity.
2 × 10Gb SFP+ Fiber Ports: Built with 2 Intel 82599 controllers for high-bandwidth, low-latency optical networking.
Hybrid Network Architecture: Combines 2.5GbE RJ45 and 10Gb SFP+ interfaces for flexible copper and fiber network deployment.
DDR5 Memory Support: Supports DDR5 SO-DIMM memory up to 16GB and up to 4800 MT/s.
M.2 Storage Interface: Supports 1 × M.2 Key-B+M 2280 for PCIe x1 or SATA 3.0 storage configurations.
Wireless Expansion Ready: Includes M.2 Key-B 3052, M.2 Key-E 2230, and SIM card slot for wireless or cellular module expansion.
DP + HD Display Output: Supports DP and HD display output for local setup, system management, and visualization applications.
Active Cooling Design: Equipped with a smart chassis fan for stable operation in high-bandwidth networking environments.
Compact Metal Chassis: The system measures approximately 178 × 126 × 56 mm for compact industrial and edge deployments.

Core Specifications

Model: H31F N300 3L2S
Processor Platform: Intel Processor N-series
Socket: FCBGA1264
Graphics: Intel UHD Graphics
Memory: DDR5 SO-DIMM, up to 16GB, up to 4800 MT/s
Network: 3 × 2.5GbE RJ45, 2 × 10Gb SFP+
Network Controllers: 3 × Intel I226V, 2 × Intel 82599
Storage: 1 × M.2 Key-B+M 2280, PCIe x1 / SATA 3.0
Expansion: 1 × M.2 Key-B 3052, 1 × M.2 Key-E 2230
Display: 1 × DP, 1 × HD
USB: 5 × USB-A 2.0, 1 × USB-A 3.0
Communication: 1 × J_COM
Other Interfaces: 1 × SIM card slot, 1 × J_GPIO, 2 × reserved antenna holes
Cooling Method: Active cooling with 1 × smart chassis fan
Power Input: DC 12V 7A or higher
Chassis Size: 178 × 126 × 56 mm
Device Weight: Approx. 1.25 KG; package weight approx. 1.95 KG including accessories
Operating Temperature: 0°C to 50°C
Operating Humidity: 5% to 90% relative humidity, non-condensing